Chemical Mechanical Polishing (CMP) Pad Market
Chemical Mechanical Polishing (CMP) Pad Market Trends, Opportunity, and Forecast Analysis, 2024-2033
Chemical mechanical polishing (CMP) pad market revenue to generate USD 7.2 Billion by 2033, according to KDMI analyst’s growth analysis. The market is segmented by wafer Size, and by Region.
Chemical Mechanical Polishing (CMP) Pad Market Size Survey Report – In a Glance
As per the survey report on global Chemical mechanical polishing (CMP) pad market, the market is projected to foresee a CAGR of 7.9% between 2024-2033, and further generate a market size of USD 7.2 billion revenue by the end of 2033. In the year 2024, the market size was valued at USD 4.1 billion revenue.
- The global Chemical mechanical polishing (CMP) pad market is projected to grow on account of the rising semiconductor industry.
- In Japan, the Chemical mechanical polishing (CMP) pad market growth can be attributed to the developing advanced technologies.
- KDMI analyst’s growth analysis foresees high cost involved in manufacturing to challenge the market growth.
- Asia-Pacific (APAC), having the highest market share in the Chemical mechanical polishing (CMP) pad market, is projected to dominate the global market.
Chemical Mechanical Polishing (CMP) Pad Market Analysis
A chemical mechanical polishing (CMP) pad is a type of consumable used in the manufacturing of semiconductors to accomplish super smooth planer surfaces on wafers. The semiconductor industry is a key user of CMP pads due to the growing uses of applications such as smartphones, automotive electronics, IoT devices, and AI technologies. The rising semiconductor industry across the globe is creating the need for more precise and efficient CMP pads, eventually propelling the CMP pad market forward. According to the Semiconductor Industry Association (SIA), global semiconductor sales closed 2024 on a high note with sales of $56.9 billion during the month of October 2024 which was an increase of 22.1% compared to October 2023 of a total of $46.6 billion. Lapmaster Wolters GmbH, LAM Research Corporation, Cabot Microelectronics Corporationare, some of the significant parties in the global market for Chemical mechanical polishing (CMP) pad.
Analyst’s Observation on Japan Chemical Mechanical Polishing (CMP) Pad Market Survey
In Japan, the market growth for Chemical mechanical polishing (CMP) pad can be attributed to the developing advanced technologies. The country is reaching new heights with its increasingly advanced technologies like high-performance computing, cutting-edge packaging methods, and AI (artificial intelligence) which is ultimately pushing the CMP pad market forward. Japan holds the 8th position overall in the Asia-Pacific region in the International Institute for Management Development's (IMD) Digital Competitiveness Ranking (2023) covering 64 countries, which shows Japan’s encouragement and investment in the digitalization and research & development (R&D) of new technologies. Additionally, technological advancements like the development of smaller feature sizes of semiconductors, further, generate the need for more accurate and effective CMP pads, boosting the overall CMP pads market growth. Hubei Dinglong, Fujibo, Hitachi Chemical INC, are some of the significant parties in the market for Chemical mechanical polishing (CMP) pad in Japan.
Chemical Mechanical Polishing (CMP) Pad Market: Report Scope |
|
Base Year |
2023 |
Estimated Market Size |
USD 4.1 Billion in 2024 |
Forecast Year |
2024-2033 |
Projected Market Size |
USD 7.2 Billion in 2033 |
CAGR Value |
7.9% |
Chemical mechanical polishing (CMP) pad Market Key Trends/Major Growth Drivers |
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Restraint Factors |
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Chemical mechanical polishing (CMP) pad Market Segmentation |
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Chemical mechanical polishing (CMP) pad Market Key Players |
Cabot Microelectronics Corporation, CMC Materials, DOW Electronic Materials, Ebara Corporation, Fujimi Incorporation, and others. |
Chemical Mechanical Polishing (CMP) Pad Market Growth Driver and Challenges
Market Growth Drivers
Rising adoption of packaging technologies:
Packaging is a vital piece in the semiconductor manufacturing industry, impacting the potency, performance, and price of the product. In today’s world, the increasing acceptance of packing technologies, such as 3DE ICs, through silicon vias (TSVs), and fan-out wafer-level packaging (FOWLP) demands advanced CMP polishing and surface preparation solutions, again pushing the CMP pad market forward. Chemical mechanical polishing (CMP) pads are necessary for smooth polishing, surface unevenness, and defective advanced packaging processes. A study found that the semiconductor packaging materials market covered US$22 billion in 2023 globally which was estimated to be about US$28 billion in 2028 at a 5.6% CAGR. Also, the global market is predicted to cross $26 billion by 2025, with a 5.6% compound annual growth rate (CAGR) projected through 2028.
Restraint Factor and Market Challenges
High cost involved in manufacturing:
One of the major obstacles in the chemical mechanical polishing (CMP) pad market is the high cost and complexity coupled with the manufacturing of CMP equipment and consumables including slurries, pads, and conditioning tools. Moreover, leading-edge equipment like that of semiconductor nodes involves large expenditures. As per findings, the cost of consumables (CoC) governs the cost of ownership (CoO) with pad and slurry costs generally making up more than 60%. Therefore, the overall elevated costs can create a blockage in the adoption of CMP consumables especially by the small manufacturers or market newcomers, hindering the progression of the CMP pads market.
Chemical Mechanical Polishing (CMP) Pad Market Segmentation
Our experts at KD Market Insights have segmented the global Chemical mechanical polishing (CMP) pad market research report as :
By Wafer Size |
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By Region |
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Chemical Mechanical Polishing (CMP) Pad Market Regional Synopsis
The Asia-Pacific (APAC) Chemical mechanical polishing (CMP) pad market is majorly driven by the rise in investment in semiconductor manufacturing industries and expansion in the consumer electronics sector. On a global scale, Asia-Pacific is the semiconductor manufacturing hub which includes countries like Japan, Taiwan, China, and South Korea. Among all, China is the top purchaser buying more than 50% of the chips manufactured globally. The strong investments from China in the semiconductor capital equipment segment helped the CMP pad market to thrive in the region. Reports revealed that about 55% of global semiconductor patent applications were Chinese in origin, in 2021–2022, and China’s number of applications doubled America’s while Chinese entities exceeded U.S. and Japanese ones for semiconductor patents granted in 2022.
North America is the most rapidly growing zone in the CMP pads market due to its ongoing research on chip technology, flourishing optics industries, increasing demand for higher performance, and the need for finer feature sizes. Moreover, with the increasing demand for chip production, many nations are producing more semiconductors and are coming up with more innovations. According to reports, the U.S. government implemented the landmark CHIPS and Science Act to provide investments required for semiconductor research and manufacturing, bolstering America’s economy, national security, and supply chains. Furthermore, other contributing factors to the fast expansion of the market include high technologies such as cloud computing, autonomous vehicles, and artificial intelligence that eventually help to attain more accuracy and reliability in chips.
As per our analysts at KD Market Insights, the following five players lead the Asia-Pacific (PAC) Chemical mechanical polishing (CMP) pad market growth:
- Cabot Microelectronics Corporation
- Merck Group
- Solvay S.A.
- Entegris Inc
- Logitech International SA
Chemical Mechanical Polishing (CMP) Pad Market Competitive Landscape
Some of the key players who top the global Chemical mechanical polishing (CMP) pad market share:
- 3M Co
- DuPont de Nemours, Inc.
- Fujibo Holdings Inc.
- Pureon
- SK enpulse
- Executive Summary
- Market Overview
- Key Findings
- Market Trends
- Market Outlook
- Introduction
- Scope of the Report
- Research Methodology
- Definitions and Assumptions
- Acronyms and Abbreviations
- Market Dynamics
- Drivers
- Restraints
- Opportunities
- Challenges
- Global Chemical Mechanical Polishing (CMP) Pads Market
- Market Overview
- Market Size and Forecast
- Market Segmentation
- By Type
- By Technology
- By Application
- By Region
- Market Segmentation by Type
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- CMP Consumable
- CMP Equipment
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- Market Segmentation by Technology
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- Leading Edge
- More than Moore’s
- Emerging
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- Market Segmentation by Application
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- Compound semiconductors
- Integrated circuits
- MEMS (microelectromechanical systems)
- NEMS (nanoelectromechanical systems)
- Other applications
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- Regional Analysis
- North America
- United States
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Canada
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Mexico
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- United States
- Europe
- United Kingdom
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Germany
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- France
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Italy
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Spain
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Rest of Europe
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- United Kingdom
- Asia Pacific
- China
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Japan
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- India
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Australia
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- South Korea
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Rest of Asia Pacific
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- China
- Latin America
- Brazil
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Argentina
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Colombia
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Rest of Latin America
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Brazil
- Middle East & Africa
- South Africa
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Saudi Arabia
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- UAE
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- Rest of Middle East & Africa
- Market Size and Forecast
- Key Trends and Developments
- Market Analysis by Type, Technology, and Application
- South Africa
- North America
- Competitive Landscape
- Market Share Analysis
- Company Profiles
- Medtronic (Ireland)
- IBM
- Apple Inc.
- Siemens Medical Solutions
- Pepperl+Fuchs
- Cisco
- GE Healthcare
- Strategic Recommendations
- Appendix
- List of Tables
- List of Figures
- References
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